Mô Đun Nhiệt Cho Máy In 3d 210a Mosfet - Ramps 1.4
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chủ nhật 23/05/2021 lúc 04:34 CH
Decription:
Features:
Style 1:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 60*50mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-24V
Maximum current with active cooling: 210A
Style 2:
Size: 70*45mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 62.8*37.8mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-50V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working
Included:
1 set x Module Kit
Features:
Style 1:
Heated bed power module
Based on powerful MOSFET HA210NO6
Size: 60*50mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 54*43mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-24V
Maximum current with active cooling: 210A
Style 2:
Size: 70*45mm
Mounting holes: 3.2mm diameter, for M3 screws.
Distance betweeen holes: 62.8*37.8mm
Very powerful MOSFET to withstand higher current than normal RAMPS or other 3D Printer controller can handle
Voltage: 12V-50V
Maximum current with active cooling: 210A
This module is based on power MOSFET and will allow PID control of the heated bed (DC-DC Relays usually do not allow this)
Under the premise of normal cooling, it work stable under I(Max)=25A, the current must not exceed 25A while the process working
Included:
1 set x Module Kit